Tribology,
Inc./Tech Lube's Silicone & Non-Silicone HEAT SINK
COMPOUNDS (HSC-S & HSC-NS) were sepcifically designed
and formulated for industrial use where heat transfer
applications are required.
Typically,
HEAT SINK COMPOUNDS are used in OEM Electronic Component
Plants to insure fast, accurate heat transfer in electronic
components and circuitry. Other uses and applications
for this product include:
• |
Semiconductor
Mounting Devices. |
• |
Ballast
heat transfer mediums. |
• |
Thermocouple
wells. |
|
• |
Thermal
Joints. |
• |
Power
resistor mountings. |
• |
Transistor
diodes & silicone rectifier base and mounting
studs. |
|
| • |
ALL
electric and electronic devices where efficient
heat transfer cooling through thermal coupling
is required!!!! |
|
TTL
HEAT SINK COMPOUNDS provide for many advantages including:
• |
Pasty
consistency for ease of application. |
• |
Insure
rapid and efficient thermal conductivity. |
•
|
Excellent
heat dissipation. |
• |
Extended
protection for all components. |
• |
High
temperature, low bleed stability. |
• |
Will
not harden or dry out, even when exposed to extreme
conditions. |
• |
Compatible
with plastic and metal components. |
• |
Low
bleed/low evaporation |
• |
"No
creep" properties (HSC-NS recommended) |
TTL-HSC-NS
Non-Silicone Heat Sink Compound
TTL-HSC-NS
is
a NON-SILICONE Heat Sink compound designed to eliminate
the potential problems of silicone based compounds, caused
by migration and component contamination. This compound
uses a special synthetic base, fortified with metal oxides
and compounded to a paste-like consistency for ease of
application.
The
highly efficient thermal conductive properties of TTL
HSC-NS mean a more rapid transfer of heat for longer component
life. The high temperature stability provides physical
properties of low bleed & low evaporation for long
term service in any application that requires Heat Sink
Compounds. TTL HSC-NS will not dry out, harden, melt or
migrate in any Heat Sink application.
The
use of synthetic fluids and metal oxide fillers provides
excellent conductive properties that exceed those of other
heat sink formulas.TTL HSC-NS is compatible with metal
and plastic components used in the fabrication of electronic
devices. The high temperature stability and "no creep"
properties of this compound mean a longer and more efficient
life for all types of hardware designs.
TTL-HSC-S
Silicone Heat Sink Compounds
TTL-HSC-S
is a silicone based material with a paste type consistency,
for ease of application. The compound is heavily fortified
with heat-conductive metal oxides to insure rapid and
efficient thermal conductivity.
Heat
dissipation between power components in electrical and
electronic assemblies is facilitated by the ability of
this compound to fill the voids and gaps between all surface
configurations in the device.
TTL-HSC-S
provides extended protection for all components because
of its high temperature - low bleed stability, It will
not harden, even when exposed to extreme temperatures
for indefinite periods of time, in all atmospheres.
TTL-HSC-S
is a thermal transfer agent that is compatible with plastic
and metal components insuring trouble-free and effective
life in all equipment designs.
Physical
Properties
| Physical
Properties |
| |
Test
Method |
TTL-HSC-NS
|
TTL-HSC-S |
| Appearance |
Visual |
Off
White/Smooth Paste |
White/Smooth
Paste |
| Consistency |
ASTM
D-217 |
300-320 |
300-320 |
| Specific
Gravity |
@25°C
(77°F) |
2.5
min. |
2.5
min. |
Bleed
%
24 hrs. @ 200°C |
FTM-321 |
1.0%
max |
1.0%
max |
Evaporation
%
24 hrs. @ 200°C |
FTM-321 |
2.0%
max |
2.0%
max |
| Dropping
Point |
ASTM
D-566 |
>500°F
(260°C) |
>500°F
(260°C) |
| Electrical
Properties |
| (K
Factor, Cal/Sec. cm °K) |
Heat
Flow @ 36°C |
18.48
x 10-4 |
18.44
x 10-4 |
| Dialectric
Strength(0.05
GAP) |
ASTM
D-149 |
350
v/mil |
390
v/mil |
| Dielectric
Constant(at 1000 Hz) |
ASTM
D-150 |
4.4 |
4.4 |
| Dissipation
Factor(at 1000 Hz) |
ASTM
D-150 |
0.0021 |
0.0021 |
| Volume
Resistivity(Room temperature) |
ASTM
D-257 |
6.38
x 1013 ohm/cm |
2.89
x 1014 ohm-cm |
